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Mica to Provide Scholarship Opportunity for TAPPI Student Member

In April, Mica Corporation and TAPPI, in conjunction with the TAPPI FlexPack PLACE Conference, will award a $4,000 scholarship to a TAPPI Student Chapter member enrolled in a packaging or related major.

Mica Corporation and the Siegel Family established the Daniel Siegel Memorial Scholarship fund in 2010 as a tribute to Mica's founder and to the ideals that he held dear. He believed that imagination and creativity should be fostered and that higher education should be available to all who aspire to it. Over the last decade, the scholarship has helped some of the best and brightest rising stars in the packaging industry continue their education at universities such as Clemson and Washington State.
If you, or someone you know, are a TAPPI Student Chapter member in a packaging program, apply before the February 15th deadline.


Criteria for Eligibility for the Daniel Siegel Scholarship

  1. Be a high school senior, college undergraduate, or graduate student as of the date of the application and attending college full time on the date of the award.
  2. Must be a student member of a TAPPI or of a TAPPI Student Chapter and be enrolled in a packaging or related major.
  3. Must exhibit respectable academic standing.
  4. Demonstrate an interest in the technological areas covered by the International Flexible Packaging and Extrusion Division.

A student may apply for the scholarship each even-numbered year, but the award will not be given to the same person twice consecutively.

Application Procedure

The following items need to be received by TAPPI no later than February 15, 2022, to be considered for this year's award.

  1. A completed Scholarship Checklist and TAPPI Division Scholarship General Information Form. (Request one by e-mailing standards@tappi.org)
  2. Official or Unofficial transcript of grades.
  3. Letter of recommendation from a faculty member.
  4. Optional – Letter of recommendation from an individual who can attest to the applicant’s character, academic ability, or interest in packaging or related fields.
  5. Send all of the above to:

TAPPI

Attention: TAPPI Flexible Division Awards Committee

15 Technology Parkway South, Suite 115

Peachtree Corners, GA 30092

Selection and Notification

The Division Awards Committee will select the recipient of the Daniel Siegel Scholarship.  Preference in the selection of the scholarship recipient will be given to the applicant able to demonstrate seriousness in pursuing a career in the packaging industry.  In making its selection, the Awards Committee will not only consider the documentation submitted but may also, if it so chooses, conduct interviews with individual applicants, by telephone if personal interviews are not practical.  The scholarship recipient will be notified as soon as the selection process has been completed.  Unsuccessful applicants will also receive notification.

 

To learn more or apply, please visit the TAPPI IFPED website.