The Daniel Siegel Memorial Scholarship
Mica Corporation's founder, Daniel "Dan" Siegel, was a trailblazer. His innovations in water-based adhesive technology were game-changers in their time, and continue to be the standard for worldwide manufacturers of flexible packaging materials to date. His forward-thinking mentality, and ability to adapt and grow with an ever-changing industry are the reasons Mica Corporation has been a leader in the manufacturing of water-based adhesives for over four decades.
When Dan passed away in 2010, Mica Corporation and the Siegel family established "The Daniel Siegel Memorial Scholarship," to honor the memory of an incredible innovator, husband, father, founder, and friend.
The scholarship is presented and awarded by the Technical Association of the Pulp and Paper Industry (TAPPI) to qualified undergraduate candidates in flexible packaging programs. Every two years, one winning candidate is awarded the scholarship at the USA TAPPI International Flexible Packaging and Extrusion Division Conference (Formerly PLACE) Conference.
If you are interested in applying for the scholarship, you can download the application or send inquiries to scholarships@tappi.org.
Scholarship Recipients
2012: Natalie Quin; Clemson University
2014: Kanishka Bhunia; Washington State University
2016: Hongchao Zhang; Washington State University
2018: Pasquale Caccavella; Clemson University
About Mica Corporation:
Mica Corporation manufactures and supplies water-based, environmentally responsible products that offer adhesion or other properties to plastic,
About TAPPI:
TAPPI is the leading association for the worldwide pulp, paper, packaging and converting industries and publisher of Paper 360° and TAPPI JOURNAL. Through information exchange,