Applications are Now being accepted for the Dan Siegel Memorial Scholarship
In April of 2018, Mica Corporation and TAPPI, in conjunction with the TAPPI International Flexible Packaging and Extrusion Division Conference (Formerly the PLACE Conference), will award a $4,000 scholarship to a TAPPI Student Chapter member enrolled in a packaging or related major. Applications for the scholarship will be accepted until February 15, 2018.
Mica Corporation and the Siegel Family established the Daniel Siegel Scholarship fund as a tribute to Dan Siegel and to the ideals that he held dear. He believed that imagination and creativity should be fostered and that higher education should be available to all who aspire to it. He was a strong supporter of the TAPPI tradition of sharing knowledge to advance technology and increase sustainability in industrial manufacturing.
Criteria for Eligibility for the Daniel Siegel Scholarship
A student may apply for the scholarship each even-numbered year, but the award will not be given to the same person twice consecutively.
The following items need to arrive to TAPPI no later than February 15, 2018 to be considered for this year's award.
Attention: TAPPI Flexible Division Awards Committee
15 Technology Parkway South, Suite 115
Peachtree Corners, GA 30092
Selection and Notification
The Division Awards Committee will select the recipient of the Daniel Siegel Scholarship. Preference in the selection of the scholarship recipient will be given to the applicant able to demonstrate seriousness in pursuing a career in the packaging industry. In making its selection, the Awards Committee will not only consider the documentation submitted but may also, if it so chooses, conduct interviews with individual applicants, by telephone if personal interviews are not practical. The scholarship recipient will be notified as soon as the selection process has been completed. Unsuccessful applicants will also receive notification.
To learn more, please visit: